Stellantis and Foxconn sign a MoU for new flexible semiconductors for the automotive industry

7 December 2021, 10:18:35

Stellantis and Foxconn (Hon Hai Technology Group) announced the signing of a non-binding memorandum of understanding to create a partnership with the intent to design a family of purpose-built semiconductors to support Stellantis and third-party customers.

This partnership was announced as part of the Stellantis Software Day 2021 event where the Company unveiled STLA Brain, the new electrical/electronic and software architecture launching in 2024 across Stellantis' four battery-electric vehicle-centric platforms – STLA Small, Medium, Large, and Frame. STLA Brain is fully OTA capable, making it highly flexible and efficient.

The collaboration will support Stellantis' initiatives to reduce semiconductor complexity, design an all-new family of purpose-built semiconductors to support Stellantis vehicles, and provide capabilities and flexibility in this area of growing importance as vehicles become increasingly software-defined.

The partnership will leverage Foxconn's domain know-how, development capabilities, and supply chain in the semiconductor industry, as well as Stellantis’ expansive automotive expertise and significant scale as a lead customer for the enterprise.

Foxconn has a long-running history of developing semiconductors and applications within consumer electronics, which will expand to the automotive space with the guidance and demand of a world-class mobility partner. These same semiconductors will be utilized within the Foxconn EV ecosystem as Foxconn continues to extend its capabilities in electric vehicle manufacturing.

Today's announcement marks the second collaboration between Stellantis and Foxconn. In May, the companies announced the Mobile Drive joint venture aimed at developing smart cockpit solutions enabled by advanced consumer electronics, HMI interfaces and services that will exceed customer expectations.

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